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On-Chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams up to fracture
Primary tabs
Document type | Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection, Abstract |
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Publication date | 2013 |
Language | Anglais |
Conference | "PiezoNEMS 2013 - PHELMA-Polygone", Grenoble, France (11/11/2013) |
Peer reviewed | yes |
Host document | "Book of abstracts" |
Publication status | Publié |
Affiliations |
UCL
- SST/ICTM/ELEN - Pôle en ingénierie électrique UCL - SST/IMMC/MEMA - Applied mechanics and mathematics UCL - SST/IMMC/IMAP - Materials and process engineering |
Links |
Bibliographic reference | Raskin, Jean-Pierre ; Bhaskar, Umesh Kumar ; Pardoen, Thomas. On-Chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams up to fracture.PiezoNEMS 2013 - PHELMA-Polygone (Grenoble, France, 11/11/2013). In: Book of abstracts, 2013 |
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Permanent URL | http://hdl.handle.net/2078.1/173413 |