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Displaying 461 - 1162 of 1162 results.

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    • Speech
    The low-frequency noise behaviour of graded-channel SOI nMOSFETs
    Simoen, E. Flandre, Denis[UCL] Claeys, C. Chung, T. M. Pavanello, M. A. Martino, J. A. Raskin, Jean-Pierre[UCL] (2007) 2nd Workshop of the Thematic-Network-on-Silicon-on-Insulator-Technology-Devices-and-Circuits (EUROSOI 06) — Grenoble (France)
    • Journal article
    Bulk and surface micromachined MEMS in thin film SOI technology
    Raskin, Jean-Pierre[UCL] Flandre, Denis[UCL] Iker, François[UCL] André, Nicolas[UCL] Olbrechts, Benoit[UCL] Pardoen, Thomas[UCL] (2007) Electrochimica Acta — Vol. 52, no. 8, p. 2850-2861 (2007)
    • Journal article
    Compositional Engineering of Cu-Doped SnO Film for Complementary Metal Oxide Semiconductor Technology
    Hong, Ruohao He, Penghui Zhang, Sen Hong, Xitong Tian, Qianlei Liu, Chang[UCL] Bu, Tong Su, Wanhan Li, Guoli[UCL] Flandre, Denis[UCL] (2024) Nano Letters : a journal dedicated to nanoscience and nanotechnology — Vol. 24, no.4, p. 1176-1183 (2024)
    • Speech
    Mutual Inductance Evaluation Between Two Parallel Conductors on a PCB
    Chouaibi, Sana Said, Mohammed Hadj Nasr, Dorra Ayed, Mossaad Ben Flandre, Denis[UCL] Tounsi, Fares[UCL] (2023) 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS) — Istanbul, Turkey
    • Speech
    Effect of Silicon Substrate Resistivity on Large- Area High-Voltage Spiral Inductor Performance
    Zeidi, Najeh[UCL] Rack, Martin[UCL] André, Nicolas[UCL] Tounsi, Fares[UCL] Raskin, Jean-Pierre[UCL] Flandre, Denis[UCL] (2023) 2023 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS — Valetta, Malta
    • Speech
    A 0.9-nA Temperature-Independent 565-ppm/°C Self-Biased Current Reference in 22-nm FDSOI
    Lefebvre, Martin[UCL] Flandre, Denis[UCL] Bol, David[UCL] (2022) ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC) — Milan (Italy)
    • Journal article
    A 1.1- / 0.9-nA Temperature-Independent 213- / 565-ppm/°C Self-Biased CMOS-Only Current Reference in 65-nm Bulk and 22-nm FDSOI
    Lefebvre, Martin[UCL] Flandre, Denis[UCL] Bol, David[UCL] (2023) IEEE Journal of Solid-State Circuits — Vol. 58, no. 8, p. 2239-2251 (2023)

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