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Surface characterization of a low dielectric constant polymer-SiLK* polymer, and investigation of its interface with Cu

Bibliographic reference Rajagopal, A ; Grégoire, Charles ; Lemaire, JJ ; Pireaux, Jean-Jacques ; Baklanov, MR ; et. al. Surface characterization of a low dielectric constant polymer-SiLK* polymer, and investigation of its interface with Cu.1st International Conference on Advanced Materials and Processes for Microelectronics (SAN JOSE (California), Mar 15-18, 1999). In: Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures, Vol. 17, no. 5, p. 2336-2340 (1999)
Permanent URL http://hdl.handle.net/2078.1/62369