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Displaying 4 results.
    • Speech
    Through silicon via to FinFET noise coupling in 3-D integrated circuits
    Abadi, A. R. N. Rack, Martin[UCL] Raskin, Jean-Pierre[UCL] (2015) 2015 International conference on IC Design & Technology — Leuven, Belgium
    • Speech
    Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
    Rack, Martin[UCL] Raskin, Jean-Pierre[UCL] (2015) 2015 IEEE MTT-S International Microwave Symposium — Phoenix, Arizona, USA
    • Speech
    Noise coupling between TSVs and active devices: Planar nMOSFETs vs. nFinFETs
    Sun, Xiao Rack, Martin[UCL] Raskin, Jean-Pierre[UCL] (2015) 2015 IEEE 65th Electronic Components and Technology Conference — San Diego, CA, USA
    • Speech
    Modeling of Anomalous CV curves in TSVs after wafer thinning
    Rack, Martin[UCL] Raskin, Jean-Pierre[UCL] Ben Ali, Khaled[UCL] (2014) Program Technical Week 2014 — imec, Leuven, Belgium