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A dynamic study for wafer-level bonding strength uniformity in low temperature wafer bonding

Bibliographic reference Zhang, Xuan Xiong ; Raskin, Jean-Pierre. A dynamic study for wafer-level bonding strength uniformity in low temperature wafer bonding. In: Electrochemical and Solid-State Letters, Vol. 8, no. 10, p. G268-G270 (October)
Permanent URL http://hdl.handle.net/2078.1/85814