Accès à distance ? S'identifier sur le proxy UCLouvain
A dynamic study for wafer-level bonding strength uniformity in low temperature wafer bonding
Primary tabs
Document type | Article de périodique (Journal article) |
---|---|
Publication date | 2005 |
Language | Anglais |
Journal information | "Electrochemical and Solid-State Letters" - Vol. 8, no. 10, p. G268-G270 (October) |
Peer reviewed | yes |
issn | 1099-0062 |
e-issn | 1944-8775 |
Publication status | Publié |
Affiliations |
UCL
- UCL - FSA/ELEC - Département d'électricité |
Links |
Bibliographic reference | Zhang, Xuan Xiong ; Raskin, Jean-Pierre. A dynamic study for wafer-level bonding strength uniformity in low temperature wafer bonding. In: Electrochemical and Solid-State Letters, Vol. 8, no. 10, p. G268-G270 (October) |
---|---|
Permanent URL | http://hdl.handle.net/2078.1/85814 |