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Direct wafer bonding issues : surface activation, high and low temperature annealing and insertion of a ductile layer for absorbing constraints

Bibliographic reference Olbrechts, Benoit ; Bertholet, Y. ; Pardoen, Thomas ; Raskin, Jean-Pierre. Direct wafer bonding issues : surface activation, high and low temperature annealing and insertion of a ductile layer for absorbing constraints.Workshop on Wafer Bonding for MEMS Technologies (Halle, Germany, du 11/10/2004 au 12/10/2004). In: Proceedings of the Workshop on Wafer Bonding for MEMS Technologies, 2004, p. 25-26
Permanent URL http://hdl.handle.net/2078.1/76768