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Steady-state measurement of fracture energy in wafer bonding

Bibliographic reference Bertholet, Yannick ; Zhang, Xuan Xiong ; Raskin, Jean-Pierre ; Pardoen, Thomas. Steady-state measurement of fracture energy in wafer bonding.27th Annual Meeting of The Adhesion Society - From Molecules and Mechanics to Optimization and Design of Adhesives Joints (Wilmington, North Carolina, U.S.A., du 15/02/2004 au 18/02/2004). In: Proceeedings of the 27th Annual Meeting of The Adhesion Society - From Molecules and Mechanics to Optimization and Design of Adhesives Joints , M.K. Chaudhury ed., The Adhesion Society Inc.2004, p. 438-440
Permanent URL http://hdl.handle.net/2078.1/76757