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Influence of a ductile interlayer on the toughness of hydrophilic wafer bonding
Primary tabs
| Document type | Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection |
|---|---|
| Publication date | 2005 |
| Language | Anglais |
| Conference | "Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology and applications, 205rd Meeting of the Electrochemical Society", Québec City, Canada (du 15/05/2005 au 20/05/2005) |
| Peer reviewed | yes |
| Host document | "Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology "- p. 264-269 |
| Publisher | Electrochemical Society (Québec, Canada) |
| Publication status | Publié |
| Affiliations |
UCL
- FSA/ELEC - Département d'électricité UCL - FSA/MAPR - Département des sciences des matériaux et des procédés |
| Links |
| Bibliographic reference | Bertholet, Y. ; Raskin, Jean-Pierre ; Pardoen, Thomas. Influence of a ductile interlayer on the toughness of hydrophilic wafer bonding.Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology and applications, 205rd Meeting of the Electrochemical Society (Québec City, Canada, du 15/05/2005 au 20/05/2005). In: Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology , Electrochemical Society : Québec, Canada2005, p. 264-269 |
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| Permanent URL | http://hdl.handle.net/2078.1/76755 |