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Influence of a ductile interlayer on the toughness of hydrophilic wafer bonding

Bibliographic reference Bertholet, Y. ; Raskin, Jean-Pierre ; Pardoen, Thomas. Influence of a ductile interlayer on the toughness of hydrophilic wafer bonding.Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology and applications, 205rd Meeting of the Electrochemical Society (Québec City, Canada, du 15/05/2005 au 20/05/2005). In: Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology , Electrochemical Society : Québec, Canada2005, p. 264-269
Permanent URL http://hdl.handle.net/2078.1/76755