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Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface

Bibliographic reference Olbrechts, Benoit ; Lejeune, Bertrand ; Bertholet, Y. ; Pardoen, Thomas ; Raskin, Jean-Pierre. Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface.9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting (Cancun, Mexico, October 29-Novemner 3). In: Proceedings of the 9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting, 2006, p. Paper 1381
Permanent URL http://hdl.handle.net/2078.1/76611