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Molecular Bonding Aided by Dissipative Interlayers
Primary tabs
| Document type | Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection |
|---|---|
| Publication date | 2007 |
| Language | Anglais |
| Conference | "1st International Congress and Exhibition on Microreliability and Nanoreliability in Key Technology Applications - MicroNanoReliability 2007", Berlin, Germany (du 02/09/2007 au 05/09/2007) |
| Peer reviewed | yes |
| Host document | "Proceedings of the 1st International Congress and Exhibition on Microreliability and Nanoreliability in Key Technology Applications - MicroNanoReliability 2007"- p. paper #3 |
| Publication status | Publié |
| Affiliations |
UCL
- FSA/ELEC - Département d'électricité UCL - FSA/MAPR - Département des sciences des matériaux et des procédés |
| Links |
| Bibliographic reference | Bertholet, Y. ; Olbrechts, Benoit ; Lejeune, B. ; Raskin, Jean-Pierre ; Pardoen, Thomas. Molecular Bonding Aided by Dissipative Interlayers.1st International Congress and Exhibition on Microreliability and Nanoreliability in Key Technology Applications - MicroNanoReliability 2007 (Berlin, Germany, du 02/09/2007 au 05/09/2007). In: Proceedings of the 1st International Congress and Exhibition on Microreliability and Nanoreliability in Key Technology Applications - MicroNanoReliability 2007, 2007, p. paper #3 |
|---|---|
| Permanent URL | http://hdl.handle.net/2078.1/76602 |