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Minimizing Plasma Damage and in situ Sealing of Ultra Low-k Dielectric Films by using Oxygen Free Fluorocarbon Plasmas

Bibliographic reference Mannaert, G. ; Baklanov, M. R. ; Le, Q. T. ; Travaly, Youssef ; Boullart, W. ; et. al. Minimizing Plasma Damage and in situ Sealing of Ultra Low-k Dielectric Films by using Oxygen Free Fluorocarbon Plasmas. In: Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures, Vol. 23, no. 5, p. 2198-2202 (2005)
Permanent URL http://hdl.handle.net/2078.1/70801