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Study of Cu diffusion in an Al(1wt% Si, 0.5wt% Cu) bond pad with an Al(1wt.% Si) bond wire attached

Bibliographic reference Cosemans, P. ; D'Haen, J. ; Witvrouw, A. ; Proost, Joris ; D'Olieslaeger, M. ; et. al. Study of Cu diffusion in an Al(1wt% Si, 0.5wt% Cu) bond pad with an Al(1wt.% Si) bond wire attached. In: Microelectronics Reliability, Vol. 38, no. 3, p. 309-315 (1998)
Permanent URL http://hdl.handle.net/2078/70725