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Electromigration-induced drift in damascene vs. plasma-etched Al(Cu). Part II : Mass transport mechanisms in bamboo interconnects

Bibliographic reference Proost, Joris ; Maex, K. ; Delaey, L.. Electromigration-induced drift in damascene vs. plasma-etched Al(Cu). Part II : Mass transport mechanisms in bamboo interconnects. In: Journal of Applied Physics, Vol. 87, no. 1, p. 99-109 (2000)
Permanent URL http://hdl.handle.net/2078/70710
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