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Electromigration-induced drift in damascene vs. plasma-etched Al(Cu). Part I : Kinetics of Cu-depletion in polycrystalline interconnects

Bibliographic reference Proost, Joris ; Witvrouw, A. ; Cosemans, P. ; D'Haen, J. ; Maex, K.. Electromigration-induced drift in damascene vs. plasma-etched Al(Cu). Part I : Kinetics of Cu-depletion in polycrystalline interconnects. In: Journal of Applied Physics, Vol. 87, no. 1, p. 86-98 (2000)
Permanent URL http://hdl.handle.net/2078/70708
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