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Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface

Bibliographic reference Olbrechts, Benoit ; Lejeune, Benoit ; Bertholet, Y. ; Pardoen, Thomas ; Raskin, Jean-Pierre. Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface. In: Electrochemical Society. Transactions, Vol. 3, no. 6, p. 279-289 (2006)
Permanent URL http://hdl.handle.net/2078.1/69263