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Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality.

Bibliographic reference Dilhaire, S. ; Cornet, Alain ; Schaub, E. ; Rauzan, C ; Claeys, W.. Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality..9th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 98) (COPENHAGEN(Denmark), 1998). In: Microelectronics Reliability, Vol. 38, no. 6-8, p. 1293-1296 (1998)
Permanent URL http://hdl.handle.net/2078.1/62412