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Peel testing of adhesively bonded thin metallic plates with control of substrate plastic straining and of debonding mode mixity

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Sener, JY Van Dooren, F Delannay, Francis [UCL]

A new peel test method has been developed for allowing debonding of adhesively bonded, thin metallic substrates. The rolling of the substrates on rollers allows control of the plastic dissipation during substrate bending and prevents dissipation associated with substrate unbending. The measured debonding toughness is shown to be independent of substrate thickness when proper account is taken of the work required for straining the adhesive layer. Mechanical analysis shows that control of plastic dissipation in substrates remains effective, as long as the ratio of the plate thickness to the roller radius is large enough to prevent wound-up. Mode mixity during debonding can be conveniently modified by changing the radii of the rollers. This possibility of altering mode mixity allows a better control of the occurrence of the cohesive, or near-interfacial debonding mechanisms. Evidence is given for the fact that the debonding mechanism is not governed by the minimum in the debonding toughness. A significant increase of debonding toughness with increasing mode mixity is observed only when the substrate roughness is high.

Document type Article de périodique (Journal article) – Article de recherche
Publication date 2001
Language Anglais
Journal information "Journal of Adhesion Science and Technology : the international journal of theoretical and basic aspects of adhesion science and its applications in all areas of technology" - Vol. 15, no. 10, p. 1165-1188 (2001)
Peer reviewed yes
Publisher Vsp Bv (Zeist)
issn 0169-4243
e-issn 1568-5616
Publication status Publié
Affiliation UCL - FSA/MAPR - Département des sciences des matériaux et des procédés
Keywords peel test ; structural adhesives ; metallic plates ; plastic strain ; interfacial toughness
Links
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Bibliographic reference Sener, JY ; Van Dooren, F ; Delannay, Francis. Peel testing of adhesively bonded thin metallic plates with control of substrate plastic straining and of debonding mode mixity. In: Journal of Adhesion Science and Technology : the international journal of theoretical and basic aspects of adhesion science and its applications in all areas of technology, Vol. 15, no. 10, p. 1165-1188 (2001)
Permanent URL http://hdl.handle.net/2078.1/42442