User menu

Adhesion and separation models for direct hydrophilic bonding

Bibliographic reference Navarro, Etienne ; Bréchet, Yves ; Barthelemy, A. ; Radu, I. ; Pardoen, Thomas ; et. al. Adhesion and separation models for direct hydrophilic bonding. In: Journal of Applied Physics, Vol. 117, p. 085305-1 - 085305-6 (2015)
Permanent URL http://hdl.handle.net/2078.1/155958
  1. Gao Huajian, Wang Xiang, Yao Haimin, Gorb Stanislav, Arzt Eduard, Mechanics of hierarchical adhesion structures of geckos, 10.1016/j.mechmat.2004.03.008
  2. Tong Q.-Y., Semiconductor Wafer Bonding: Science and Technology (1999)
  3. Stengl R., Tan T., Gösele U., A Model for the Silicon Wafer Bonding Process, 10.1143/jjap.28.1735
  4. Greenwood J. A., Williamson J. B. P., Contact of Nominally Flat Surfaces, 10.1098/rspa.1966.0242
  5. Fuller K. N. G., Tabor D., The Effect of Surface Roughness on the Adhesion of Elastic Solids, 10.1098/rspa.1975.0138
  6. Maugis D., On the contact and adhesion of rough surfaces, 10.1163/156856196x00832
  7. Gui C., Elwenspoek M., Tas N., Gardeniers J. G. E., The effect of surface roughness on direct wafer bonding, 10.1063/1.369377
  8. Rieutord Francois, Moriceau H., Beneyton Rémi, Capello Luciana, Morales Christophe, Charvet Anne-Marie, Rough Surface Adhesion Mechanisms for Wafer Bonding, 10.1149/1.2357071
  9. Miki N., Spearing S. M., Effect of nanoscale surface roughness on the bonding energy of direct-bonded silicon wafers, 10.1063/1.1621086
  10. Timpel Dirk, Schaible Max, Scheerschmidt Kurt, Molecular dynamics studies of silica wafer bonding, 10.1063/1.369579
  11. Litton David A., Garofalini Stephen H., Modeling of hydrophilic wafer bonding by molecular dynamics simulations, 10.1063/1.1351538
  12. Cole Daniel J., Payne Mike C., Csányi Gábor, Mark Spearing S., Colombi Ciacchi Lucio, Development of a classical force field for the oxidized Si surface: Application to hydrophilic wafer bonding, 10.1063/1.2799196
  13. Leroch Sabine, Wendland Martin, Simulation of Forces between Humid Amorphous Silica Surfaces: A Comparison of Empirical Atomistic Force Fields, 10.1021/jp302428b
  14. Asay David B., Kim Seong H., Effects of adsorbed water layer structure on adhesion force of silicon oxide nanoasperity contact in humid ambient, 10.1063/1.2192510
  15. Grierson David, Turner Kevin T., Characterization of Hysteresis of Surface Energy in Room-Temperature Direct Bonding Processes, 10.1149/1.3483549
  16. Spierings G.A.C.M., Haisma J., Michelsen T.M., Surface-related phenomena in the direct bonding of silicon and fused-silica wafer pairs, 10.1016/0165-5817(95)82003-5
  17. Rieutord F., Bataillou B., Moriceau H., Dynamics of a Bonding Front, 10.1103/physrevlett.94.236101
  18. Navarro E., Bréchet Y., Moreau R., Pardoen T., Raskin J.-P., Barthelemy A., Radu I., Direct silicon bonding dynamics: A coupled fluid/structure analysis, 10.1063/1.4813312
  19. Maszara W. P., Goetz G., Caviglia A., McKitterick J. B., Bonding of silicon wafers for silicon‐on‐insulator, 10.1063/1.342443
  20. Bertholet Y., Iker F., Raskin J.P., Pardoen T., Steady-state measurement of wafer bonding cracking resistance, 10.1016/j.sna.2003.09.004
  21. Holz Manfred, Heil Stefan R., Sacco Antonio, Temperature-dependent self-diffusion coefficients of water and six selected molecular liquids for calibration in accurate 1H NMR PFG measurements, 10.1039/b005319h
  22. de Boer M.P., de Boer P.C.T., Thermodynamics of capillary adhesion between rough surfaces, 10.1016/j.jcis.2007.02.051