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Behaviour of CPW and TFMS lines versus high temperature for RF applications in sub-45 nm nodes

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Roda Neve, Cesar [UCL] Farcy, A. [STMicroelectronics, Crolles, France] Gallitre, M. [Université de Savoie, Le Bourget du Lac, France] Blampey, B. [Université de Savoie, Le Bourget du Lac, France] Meuris, P. [Magwel, Leuven, Belgium] Raskin, Jean-Pierre [UCL]

Coplanar waveguide (CPW) and thin film microstrip (TFMS) lines integrating porous ultra low-k as inter-metal dielectric layers (k = 2.5) and copper as metal, are for the first time experimentally measured up to 110 GHz and under different temperature conditions, up to 200 °C. The extracted attenuation and propagation coefficients of those transmission lines are compared to simulations performed with MAGWEL software, a frequency domain 3-D Maxwell solver. Based on the characterization results some guidelines related to interconnect design are presented for future applications.

Document type Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection
Publication date 2009
Language Anglais
Conference "Eighteenth European Workshop on Materials for Advanced Metallization - MAM 2009", Grenoble, France (du 08/03/2009 au 11/03/2009)
Peer reviewed yes
Host document "Proceedings of the eighteenth European Workshop on Materials for Advanced Metallization - MAM 2009"- pp. 165-166
Publication status Publié
Affiliation UCL - FSA/ELEC - Département d'électricité
Links
Bibliographic reference Roda Neve, Cesar ; Farcy, A. ; Gallitre, M. ; Blampey, B. ; Meuris, P. ; et. al. Behaviour of CPW and TFMS lines versus high temperature for RF applications in sub-45 nm nodes.Eighteenth European Workshop on Materials for Advanced Metallization - MAM 2009 (Grenoble, France, du 08/03/2009 au 11/03/2009). In: Proceedings of the eighteenth European Workshop on Materials for Advanced Metallization - MAM 2009, 2009, p.pp. 165-166
Permanent URL http://hdl.handle.net/2078/123507