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An investigation on the bonding surface energy versus time in low temperature wafer bonding

Bibliographic reference Zhang, Xiaodong ; Olbrechts, Benoit ; Raskin, Jean-Pierre. An investigation on the bonding surface energy versus time in low temperature wafer bonding.The 8th International Conference on Solid-State and Integrated-Circuit Technology (Shanghai, China, du 23/10/2006 au 26/10/2006). In: Proceedings of the The 8th International Conference on Solid-State and Integrated-Circuit Technology, 2006, p.pp. 484-486
Permanent URL http://hdl.handle.net/2078.1/123255