Méndez, C.
[Open Engineering S.A., Liège, Belgium]
De Vincenzo, P.
[Open Engineering S.A., Liège, Belgium]
Klapka, I.
[Open Engineering S.A., Liège, Belgium]
Rochus, V.
[Université de Liège]
Iker, François
[UCL]
André, Nicolas
[UCL]
Raskin, Jean-Pierre
[UCL]
In this paper we present out-of-plane 3D self assembled SOI (silicon-on-insulator) MEMS that can be directly integrated to the electronic components. Because of their 3D nature, these structures can be used, for instance, as the basic elements for the construction of thermal actuators or flow sensors. We make a description of the fabrication and operation of these devices and we show how these two stages can be numerically simulated
| Bibliographic reference |
Méndez, C. ; De Vincenzo, P. ; Klapka, I. ; Rochus, V. ; Iker, François ; et. al. Modeling of the fabrication and operation of 3-D self assembled SOI MEMS.EuroSIME 2006 – Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (Milano, Italy, du 23/04/2006 au 26/04/2006). In: Proceedings of the EuroSIME 2006 – Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, 2006, p.pp. 406-410 |
| Permanent URL |
http://hdl.handle.net/2078.1/123214 |
