User menu

Extended low-temperature plasma-assisted bonding enhances wafer bonding strength uniformity

Bibliographic reference Zhang, Xiaodong ; Raskin, Jean-Pierre. Extended low-temperature plasma-assisted bonding enhances wafer bonding strength uniformity. In: MRS Bulletin, Vol. 30, no.Issue 10, pp. 688-689 (October 2005)
Permanent URL http://hdl.handle.net/2078/121827