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Displaying 24 results.
    • Journal article
    Electromigration threshold in damascene versus plasma-etched interconnects
    Proost, Joris[UCL] Maex, K. Delaey, L. (1998) Applied Physics Letters — Vol. 73, no. 19, p. 2748-2750 (1998)
    • Journal article
    Electromigration-induced drift in damascene vs. plasma-etched Al(Cu). Part I : Kinetics of Cu-depletion in polycrystalline interconnects
    Proost, Joris[UCL] Witvrouw, A. Cosemans, P. D'Haen, J. Maex, K. (2000) Journal of Applied Physics — Vol. 87, no. 1, p. 86-98 (2000)
    • Speech
    Electromigration-induced drift in damascene vs. conventional interconnects : an intrinsic difference
    Proost, Joris[UCL] Samajdar, I. Witvrouw, A. Maex, K. (1998) the Materials Research Society Symposium — San Francisco - CA
    • Speech
    A new scaling issue in the electrical behaviour of damascene vs. plasma-etched interconnects
    Proost, Joris[UCL] Conard, T. Boullart, W. Grillaert, J. Maex, K. (1998) Mater. Res. Soc. Conference on Advanced Metallization and Interconnect Systems for ULSI Applications — San Diego - CA
    • Speech
    Effect of Cu on Al interfacial mass transport in bamboo RIE and damascene Al(Cu)
    Proost, Joris[UCL] Li, H. Witvrouw, A. Maex, K. (1999) Materials Research Society Symposium — San Francisco - CA
    • Speech
    Plasticity of electromigration-induced hillocking
    Proost, Joris[UCL] Maex, K. Delaey, L. (2001) the Materials Research Society Symposium on Dislocations and Deformation Mechanisms in Thin Films and Small Structures — San Francisco - CA
    • Speech
    The control and impact of processing ambient during rapid thermal processing
    Maex, K. Kondoh, E. Lauwers, A. Steegen, A. De Potter, M. Besser, P. Proost, Joris[UCL] (1998) the Materials Research Society Symposium — Boston - MA
    • Speech
    Rapid thermal annealing of electroplated Cu films
    Beyer, G.P. Kitabjian, P. Brongersma, S.H. Proost, Joris[UCL] Bender, H. Richard, E. Vervoort, I. Hey, P. Zhang, P. Maex, K. (1999) Mater. Res. Soc. Conference on Advanced Metallization and Interconnect Systems for ULSI Applications —
    • Speech
    Electromigration behaviour of 0.3 µm damascene vs. plasma-etched interconnects : a lifetime and drift analysis
    Proost, Joris[UCL] Li, H. Brijs, B. Witvrouw, A. Maex, K. (1998) the IEEE International Interconnect Technology Conference — San Francisco - CA
    • Speech
    Stress relaxation in Al-Si-Cu thin films and lines
    Witvrouw, A. Proost, Joris[UCL] Deweerdt, B. Roussel, Ph. Maex, K. (1995) the Materials Research Society Symposium — Boston - MA
    • Speech
    A new approach for the measurement of resistivity and cross-sectional area of an aluminum interconnect line : principle and applications
    Li, H. Jin, S. Proost, Joris[UCL] Van Hove, M. Froyen, L. Maex, K. (1998) the Mater. Res. Soc. Conference on Advanced Metallization and Interconnect Systems for ULSI Applications —
    • Journal article
    Chemical and electrical characterisation of the interaction of BCl3/Cl2 etching and CF4/H2O stripping plasmas with aluminum surfaces
    Proost, Joris[UCL] Li, H. Conard, T. Boullart, W. Maex, K. (1999) Journal of The Electrochemical Society — Vol. 146, no. 11, p. 4230-4235 (1999)
    • Journal article
    Micro-texture and electromigration-induced drift in electroplated damascene Cu
    Proost, Joris[UCL] Hirato, T. Furuhara, T. Maex, K. Celis, J-P. (2000) Journal of Applied Physics — Vol. 87, no. 6, p. 2792-2802 (2000)
    • Journal article
    Study of Cu diffusion in an Al(1wt% Si, 0.5wt% Cu) bond pad with an Al(1wt.% Si) bond wire attached
    Cosemans, P. D'Haen, J. Witvrouw, A. Proost, Joris[UCL] D'Olieslaeger, M. De Ceuninck, W. Maex, K. De Schepper, L. (1998) Microelectronics Reliability — Vol. 38, no. 3, p. 309-315 (1998)
    • Journal article
    Morphology of corrosion pits in aluminum thin film metallizations
    Proost, Joris[UCL] Baklanov, M. Verbeeck, R. Maex, K. (1998) Journal of Solid State Electrochemistry — Vol. 2, no. 3, p. 150-155 (1998)
    • Journal article
    Plasticity of electromigration-induced hillocking and its effect on the critical length
    Proost, Joris[UCL] D'Haen, J. Maex, K. Delaey, L. (2002) Journal of Applied Physics — Vol. 91, no. 11, p. 9108-9115 (2002)
    • Journal article
    The role of grain boundary structure on electromigration-induced drift in pure Al and Al(0.5wt% Cu)
    Proost, Joris[UCL] Samajdar, I. Verlinden, B. Van Houtte, Paul[UCL] Maex, K. Delaey, L. (1998) Scripta Materialia — Vol. 39, no. 8, p. 1039-1045 (1998)
    • Journal article
    Critical role of degassing for hot aluminum filling
    Proost, Joris[UCL] Kondoh, E. Vereecke, G. Heyns, M. Maex, K. (1998) Journal of Vacuum Science and Technology — Vol. B16, p. 2091-2098 (1998)
    • Journal article
    Aluminum speed fill
    Beyer, G.P. Maex, K. Daniels, S. Lee, S. Proost, Joris[UCL] Bender, H. Judelewicz, M. Maity, M. (1999) Materials Science in Semiconductor Processing — Vol. 2, no. 1, p. 75-85 (1999)
    • Speech
    Incubation, time-dependent drift and saturation during Al-Si-Cu electromigration : modeling and implications for design
    Witvrouw, A. Roussel, Ph. Beyer, G. Proost, Joris[UCL] Maex, K. (1998) the IEEE International Interconnect Technology Conference —
    • Journal article
    Stress relaxation in Al(Cu) thin films
    Proost, Joris[UCL] Witvrouw, A. Cosemans, P. Roussel, Ph. Maex, K. (1997) Microelectronic Engineering — Vol. 33, no. 1-4, p. 137-147 (1997)
    • Journal article
    Stress relaxation in Al-Cu and Al-Si-Cu thin films
    Witvrouw, A. Proost, Joris[UCL] Roussel, Ph. Cosemans, P. Maex, K. (1999) Journal of Materials Research — Vol. 14, no.4, p. 1246-1254 (1999)
    • Journal article
    Compensation effect during water desorption from siloxane-based spin-on dielectric thin films
    Proost, Joris[UCL] Baklanov, M. Maex, K. Delaey, L. (2000) Journal of Vacuum Science and Technology — Vol. B18, p. 303-306 (2000)
    • Journal article
    Electromigration-induced drift in damascene vs. plasma-etched Al(Cu). Part II : Mass transport mechanisms in bamboo interconnects
    Proost, Joris[UCL] Maex, K. Delaey, L. (2000) Journal of Applied Physics — Vol. 87, no. 1, p. 99-109 (2000)