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Displaying 14 results.
    • Journal article
    Molecular bonding aided by dissipative inter-layers
    Bertholet, Y. Olbrechts, Benoit[UCL] Lejeune, B. Raskin, Jean-Pierre[UCL] Pardoen, Thomas[UCL] (2007) Acta Materialia — Vol. 55, no. 2, p. 473-479 (2007)
    • Speech
    Molecular Bonding Aided by Dissipative Interlayers
    Bertholet, Y. Olbrechts, Benoit[UCL] Lejeune, B. Raskin, Jean-Pierre[UCL] Pardoen, Thomas[UCL] (2007) 1st International Congress and Exhibition on Microreliability and Nanoreliability in Key Technology Applications - MicroNanoReliability 2007 — Berlin, Germany
    • Speech
    Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface
    Olbrechts, Benoit[UCL] Lejeune, Bertrand[UCL] Bertholet, Y. Pardoen, Thomas[UCL] Raskin, Jean-Pierre[UCL] (2006) 9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting — Cancun, Mexico
    • Speech
    Steady-state measurement and modelling of wafer bonding failure resistance
    Bertholet, Y. Iker, François[UCL] Raskin, Jean-Pierre[UCL] Pardoen, Thomas[UCL] (2002) 16th European Conference on Solid-State Transducers — Prague, Czech Republic
    • Journal article
    Effect of interfacial SiO2 thickness for low temperature O-2 plasma activated wafer bonding
    Olbrechts, Benoit[UCL] Zhang, XX Bertholet, Y. Pardoen, Thomas[UCL] Raskin, Jean-Pierre[UCL] (2006) Microsystem Technologies : micro and nanosystems - information storage and processing systems — Vol. 12, no. 5, p. 383-390 (2006)
    • Speech
    Steady state measurement of wafer bonding fracture resistance
    Bertholet, Y. Iker, F. Raskin, Jean-Pierre[UCL] Pardoen, Thomas[UCL] (2002) Eurosensors XVI, The 16th European Conference on Solid-State Transducers — Prague
    • Speech
    Influence of a ductile interlayer on the toughness of hydrophilic wafer bonding
    Bertholet, Y. Raskin, Jean-Pierre[UCL] Pardoen, Thomas[UCL] (2005) Proceedings of the Eighth International Symposium on Semiconductor Wafer Bonding; science, technology and applications, 205rd Meeting of the Electrochemical Society — Québec City, Canada
    • Speech
    Fracture resistance of interfaces in bonded silicon wafers
    Bertholet, Y. Iker, François[UCL] Zhang, Xuan Xiong[UCL] Raskin, Jean-Pierre[UCL] Pardoen, Thomas[UCL] (2004) 15th European Conference of Fracture — Stockholm, Sweden
    • Journal article
    Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface
    Olbrechts, Benoit[UCL] Lejeune, Benoit[UCL] Bertholet, Y. Pardoen, Thomas[UCL] Raskin, Jean-Pierre[UCL] (2006) Electrochemical Society. Transactions — Vol. 3, no. 6, p. 279-289 (2006)
    • Journal article
    Steady-state measurement of wafer bonding cracking resistance
    Bertholet, Y. Iker, François[UCL] Raskin, Jean-Pierre[UCL] Pardoen, Thomas[UCL] (2004) Sensors and Actuators A: Physical : an international journal devoted to research and development of physical and chemical transducers — Vol. 110, no. 1-3, p. 157-163 (2004)
    • Speech
    Bulk and surface micromachined SOI MEMS: from sensors to testing micromachines
    Raskin, Jean-Pierre[UCL] Iker, F. Andre, N. Olbrecht, B. Fabregue, D. Bertholet, Y. Flandre, Denis[UCL] Pardoen, Thomas[UCL] (2006) 4th International Society of Electrochemistry (ISE) Spring Meeting 2006 — Singapore