Accès à distance ? S'identifier sur le proxy UCLouvain
Fabrication process for applying high mechanical stress on monocrystalline silicon film
Primary tabs
| Document type | Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection |
|---|---|
| Publication date | 2010 |
| Language | Anglais |
| Conference | "6th International SemOI Conference and 1st Ukrainian-French Seminar “Semiconductor-on-Insulator materials, devices and circuits: physics, technology and diagnostics”", Kyiv, Ukraine (du 25/10/2010 au 28/10/2010) |
| Peer reviewed | yes |
| Host document | "Proceedings of the 6th International SemOI Conference and 1st Ukrainian-French Seminar “Semiconductor-on-Insulator materials, devices and circuits: physics, technology and diagnostics”"- pp. 125-126 |
| Publication status | Publié |
| Affiliations |
UCL
- SST/ICTM/ELEN - Pôle en ingénierie électrique UCL - SST/IMMC/IMAP - Materials and process engineering |
| Links |
| Bibliographic reference | Passi, Vikram ; Bhaskar, Umesh Kumar ; Pardoen, Thomas ; Raskin, Jean-Pierre. Fabrication process for applying high mechanical stress on monocrystalline silicon film.6th International SemOI Conference and 1st Ukrainian-French Seminar “Semiconductor-on-Insulator materials, devices and circuits: physics, technology and diagnostics” (Kyiv, Ukraine, du 25/10/2010 au 28/10/2010). In: Proceedings of the 6th International SemOI Conference and 1st Ukrainian-French Seminar “Semiconductor-on-Insulator materials, devices and circuits: physics, technology and diagnostics”, 2010, p.pp. 125-126 |
|---|---|
| Permanent URL | http://hdl.handle.net/2078.1/87072 |