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Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface
Primary tabs
| Document type | Communication à un colloque (Conference Paper) – Présentation orale avec comité de sélection |
|---|---|
| Publication date | 2006 |
| Language | Anglais |
| Conference | "9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting", Cancun, Mexico (October 29-Novemner 3) |
| Peer reviewed | yes |
| Host document | "Proceedings of the 9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting"- p. Paper 1381 |
| Publication status | Publié |
| Affiliations |
UCL
- FSA/ELEC - Département d'électricité UCL - FSA/MAPR - Département des sciences des matériaux et des procédés |
| Links |
| Bibliographic reference | Olbrechts, Benoit ; Lejeune, Bertrand ; Bertholet, Y. ; Pardoen, Thomas ; Raskin, Jean-Pierre. Direct Wafer Bonding enhanced by Ductile Layers inserted near the interface.9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting (Cancun, Mexico, October 29-Novemner 3). In: Proceedings of the 9th International Symposium on Semiconductor Wafer Bonding, Science, Technology and Application - Electrochemical Society Fall Meeting, 2006, p. Paper 1381 |
|---|---|
| Permanent URL | http://hdl.handle.net/2078.1/76611 |