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Minimizing Plasma Damage and in situ Sealing of Ultra Low-k Dielectric Films by using Oxygen Free Fluorocarbon Plasmas
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Document type | Article de périodique (Journal article) – Article de recherche |
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Publication date | 2005 |
Language | Anglais |
Journal information | "Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures" - Vol. 23, no. 5, p. 2198-2202 (2005) |
Peer reviewed | yes |
Publisher | American Institute of Physics |
issn | 1071-1023 |
Publication status | Publié |
Affiliations |
IMEC
- IMEC UCL - FSA/MAPR - Département des sciences des matériaux et des procédés |
Links |
Bibliographic reference | Mannaert, G. ; Baklanov, M. R. ; Le, Q. T. ; Travaly, Youssef ; Boullart, W. ; et. al. Minimizing Plasma Damage and in situ Sealing of Ultra Low-k Dielectric Films by using Oxygen Free Fluorocarbon Plasmas. In: Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures, Vol. 23, no. 5, p. 2198-2202 (2005) |
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Permanent URL | http://hdl.handle.net/2078.1/70801 |