Pampin, Rémi
[UCL]
Moreno Hagelsieb, Luis
[UCL]
Flandre, Denis
[UCL]
An alternative smart sensing paradigm to largescale biocompatible integration has been explored. Traditionally, conductive bio-labels detection profits from planar interdigitated electrodes (IDE) encapsulated between for instance a top thin alumina layer and a bottom thick silicon dioxide. Despite demonstrating good electrostatic sensitivity at strong micro-labels densities, such patterns however require sub-micron shrinking to work below 30% conductive labels coverage. We therefore derived a spectroscopic field-effect transducer from micrometric DDE coupled to a thinly insulated surface-doped silicon channel. Thanks to capacitance enhancement that results between electrodes and semiconductor, label-induced field-effect modulation of channel's conductance gives rise to an intrinsic dielectric relaxation constant change subsequently measured by impedance spectroscopy. So-called Insulated Substrate Impedance Transducers (ISIT) have thereby been designed to sense an inter-digital impedance spectrum change following a frequency-dependent multi-parameter approach. In demonstration, metallic grains densities ranging from 1.2% to 17%, ensued from 0 to 1 nM concentrations of silver-labeled 30 bp DNA targets were sensed in air on 100 * 100 mu m/sup 2/ arrays through conductance and capacitance variations by factors of 6 and 3, respectively. Our presentation will focus on simulation, optimization and characterization of ISIT's electrical operation, and present on-chip tuning possibilities associated with substrate back-contact biasing.
Bibliographic reference |
Pampin, Rémi ; Moreno Hagelsieb, Luis ; Flandre, Denis. Bio-compatible Insulated Substrate Impedance Transducers.4th European Conference of the International Federation for Medical and Biological Engineering - ECIFMBE 2008 (Antwerp, Belgium, 23-27 November 2008). In: Vander Sloten, J.; Nyssen, M.; Verdonck, P.; Haueisen, J.;, Proceedings of the 4th European Conference of the International Federation for Medical and Biological Engineering - ECIFMBE 2008, Springer verlag : Berlin, Heidelberg2009, p.1180-1183 |
Permanent URL |
http://hdl.handle.net/2078.1/67456 |