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Study of creep/relaxation mechanisms in thin freestanding nanocrystalline palladium films through the lab-on-chip technology

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Guisbiers, Grégory [UCL] Colla, Marie-Stéphane [UCL] Coulombier, Michaël [UCL] Raskin, Jean-Pierre [UCL] Pardoen, Thomas [UCL]

A nanomechanical lab-on-chip set-up has been used to study the creep/relaxation response of thin palladium films with temperature. The basic idea is to use residual stresses present in a silicon nitride thin beam to load the test film after etching the underneath sacrificial layer. The main advantage of this experimental method is that we can simultaneously perform thousands of creep/relaxation tests without monopolizing any external actuating/loading equipment and without using any time consuming calibration procedures. A signature of the dominant relaxation mechanism is given by the activation volume which has been determined for different levels of plastic deformation and different temperatures. The activation volume is equal to 15-40 b3 at room temperature and tends to decrease with increasing plastic deformation. The activation volume decreases when relaxation takes place at 50 C down to 7-20 b3. These variations of the activation volume indicate the competition between two different thermally activated deformation mechanisms in the temperature range between 20 C and 50 C.

Document type Article de périodique (Journal article) – Article de recherche
Access type Accès libre
Publication date 2013
Language Anglais
Journal information "Journal of Applied Physics" - Vol. 113, no.024513, p. 024513-1 - 024513-6 (2013)
Peer reviewed yes
Publisher American Institute of Physics ((United States) [S.l.])
issn 0021-8979
e-issn 1089-7550
Publication status Publié
Affiliation UCL - SST/IMMC/IMAP - Materials and process engineering
Links
  1. Guisbiers G, Buchaillot L, Size and shape effects on creep and diffusion at the nanoscale, 10.1088/0957-4484/19/43/435701
  2. Wei Q, Cheng S, Ramesh K.T, Ma E, Effect of nanocrystalline and ultrafine grain sizes on the strain rate sensitivity and activation volume: fcc versus bcc metals, 10.1016/j.msea.2004.03.064
  3. Gu C D, Lian J S, Jiang Q, Zheng W T, Experimental and modelling investigations on strain rate sensitivity of an electrodeposited 20 nm grain sized Ni, 10.1088/0022-3727/40/23/027
  4. Choi In-suk, Schwaiger Ruth, Kurmanaeva Lilia, Kraft Oliver, On the effect of Ag content on the deformation behavior of ultrafine-grained Pd–Ag alloys, 10.1016/j.scriptamat.2009.03.007
  5. Maier Verena, Durst Karsten, Mueller Johannes, Backes Björn, Höppel Heinz Werner, Göken Mathias, Nanoindentation strain-rate jump tests for determining the local strain-rate sensitivity in nanocrystalline Ni and ultrafine-grained Al, 10.1557/jmr.2011.156
  6. Jonnalagadda K., Karanjgaokar N., Chasiotis I., Chee J., Peroulis D., Strain rate sensitivity of nanocrystalline Au films at room temperature, 10.1016/j.actamat.2010.04.048
  7. Dao M., Lu L., Shen Y.F., Suresh S., Strength, strain-rate sensitivity and ductility of copper with nanoscale twins, 10.1016/j.actamat.2006.06.062
  8. Lu L., Schwaiger R., Shan Z.W., Dao M., Lu K., Suresh S., Nano-sized twins induce high rate sensitivity of flow stress in pure copper, 10.1016/j.actamat.2005.01.031
  9. Nyakiti Luke O., Jankowski Alan F., Characterization of Strain-Rate Sensitivity and Grain Boundary Structure in Nanocrystalline Gold-Copper Alloys, 10.1007/s11661-009-9996-9
  10. Malow T.R., Koch C.C., Miraglia P.Q., Murty K.L., Compressive mechanical behavior of nanocrystalline Fe investigated with an automated ball indentation technique, 10.1016/s0921-5093(98)00661-3
  11. Wei Q., Jiao T., Mathaudhu S.N., Ma E., Hartwig K.T., Ramesh K.T., Microstructure and mechanical properties of tantalum after equal channel angular extrusion (ECAE), 10.1016/s0921-5093(03)00305-8
  12. Wei Yujie, Bower Allan F., Gao Huajian, Enhanced strain-rate sensitivity in fcc nanocrystals due to grain-boundary diffusion and sliding, 10.1016/j.actamat.2007.12.028
  13. Gianola D.S., Warner D.H., Molinari J.F., Hemker K.J., Increased strain rate sensitivity due to stress-coupled grain growth in nanocrystalline Al, 10.1016/j.scriptamat.2006.06.002
  14. Modlinski R., Witvrouw A., Ratchev P., Puers R., Toonder J.M.J. den, Wolf I. De, Creep characterization of Al alloy thin films for use in MEMS applications, 10.1016/j.mee.2004.07.045
  15. Gravier S., Coulombier M., Safi A., Andre N., Boe A., Raskin J.-P., Pardoen T., New On-Chip Nanomechanical Testing Laboratory - Applications to Aluminum and Polysilicon Thin Films, 10.1109/jmems.2009.2020380
  16. Boé A, Safi A, Coulombier M, Fabrègue D, Pardoen T, Raskin J-P, MEMS-based microstructures for nanomechanical characterization of thin films, 10.1088/0964-1726/18/11/115018
  17. Boé A., Safi A., Coulombier M., Pardoen T., Raskin J.-P., Internal stress relaxation based method for elastic stiffness characterization of very thin films, 10.1016/j.tsf.2009.06.062
  18. Coulombier M., Boé A., Brugger C., Raskin J.P., Pardoen T., Imperfection-sensitive ductility of aluminium thin films, 10.1016/j.scriptamat.2010.01.048
  19. Karnik S.V., Hatalis M.K., Kothare M.V., Towards a palladium micro-membrane for the water gas shift reaction: microfabrication approach and hydrogen purification results, 10.1109/jmems.2002.807474
  20. DiMeo Frank, Chen Ing-Shin, Chen Philip, Neuner Jeffrey, Roerhl Andreas, Welch James, MEMS-based hydrogen gas sensors, 10.1016/j.snb.2005.05.007
  21. Coulombier M., Guisbiers G., Colla M.-S., Vayrette R., Raskin J.-P., Pardoen T., On-chip stress relaxation testing method for freestanding thin film materials, 10.1063/1.4758288
  22. Stoney G. G., The Tension of Metallic Films Deposited by Electrolysis, 10.1098/rspa.1909.0021
  23. Idrissi Hosni, Wang Binjie, Colla Marie Stéphane, Raskin Jean Pierre, Schryvers Dominique, Pardoen Thomas, Ultrahigh Strain Hardening in Thin Palladium Films with Nanoscale Twins, 10.1002/adma.201004160
  24. Wang B., Idrissi H., Shi H., Colla M.S., Michotte S., Raskin J.P., Pardoen T., Schryvers D., Texture-dependent twin formation in nanocrystalline thin Pd films, 10.1016/j.scriptamat.2012.01.038
  25. Wang B., Idrissi H., Galceran M., Colla M.S., Turner S., Hui S., Raskin J.P., Pardoen T., Godet S., Schryvers D., Advanced TEM investigation of the plasticity mechanisms in nanocrystalline freestanding palladium films with nanoscale twins, 10.1016/j.ijplas.2012.04.003
  26. Colla M.-S., Wang B., Idrissi H., Schryvers D., Raskin J.-P., Pardoen T., High strength-ductility of thin nanocrystalline palladium films with nanoscale twins: On-chip testing and grain aggregate model, 10.1016/j.actamat.2011.11.054
  27. Duhamel Cécilie, Brechet Yves, Champion Yannick, Activation volume and deviation from Cottrell–Stokes law at small grain size, 10.1016/j.ijplas.2009.10.003
  28. WANG Y, HAMZA A, MA E, Temperature-dependent strain rate sensitivity and activation volume of nanocrystalline Ni, 10.1016/j.actamat.2006.02.013
  29. Champion Yannick, Langlois Cyril, Guérin Sandrine, Duhamel Cécilie, Analysis of ductility of nanostructured copper prepared by powder metallurgy, 10.1016/j.engfracmech.2007.04.031
  30. Asaro Robert J., Suresh Subra, Mechanistic models for the activation volume and rate sensitivity in metals with nanocrystalline grains and nano-scale twins, 10.1016/j.actamat.2005.03.047
  31. Cottrell A. H., Stokes R. J., Effects of Temperature on the Plastic Properties of Aluminium Crystals, 10.1098/rspa.1955.0243
  32. Rupert Timothy J., Trenkle Jonathan C., Schuh Christopher A., Enhanced solid solution effects on the strength of nanocrystalline alloys, 10.1016/j.actamat.2010.11.026
  33. Jennings Andrew T., Greer Julia R., Heterogeneous dislocation nucleation from surfaces and interfaces as governing plasticity mechanism in nanoscale metals, 10.1557/jmr.2011.338
Bibliographic reference Guisbiers, Grégory ; Colla, Marie-Stéphane ; Coulombier, Michaël ; Raskin, Jean-Pierre ; Pardoen, Thomas. Study of creep/relaxation mechanisms in thin freestanding nanocrystalline palladium films through the lab-on-chip technology. In: Journal of Applied Physics, Vol. 113, no.024513, p. 024513-1 - 024513-6 (2013)
Permanent URL http://hdl.handle.net/2078.1/121110