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    • Journal article
    Minimizing Plasma Damage and in situ Sealing of Ultra Low-k Dielectric Films by using Oxygen Free Fluorocarbon Plasmas
    Mannaert, G. Baklanov, M. R. Le, Q. T. Travaly, Youssef Boullart, W. Vanhaelemeersch, S. Jonas, Alain M.[UCL] (2005) Journal of Vacuum Science and Technology. Part B. Microelectronics and Nanometer Structures — Vol. 23, no. 5, p. 2198-2202 (2005)